Semiconductor device manufacturing: process – Making device array and selectively interconnecting – With electrical circuit layout
Patent
1996-08-21
1999-03-23
Fourson, George
Semiconductor device manufacturing: process
Making device array and selectively interconnecting
With electrical circuit layout
438424, 438692, 364491, H01L 2176, H01L 2170
Patent
active
058858563
ABSTRACT:
A pattern of dummy structures (20) is added to the layout pattern of an integrated circuit (10) to equilibrate the polishing rate across the surface of a semiconductor substrate (11). The location of each dummy structure (20) is predetermined so that it does not intersect a well boundary (17) or an active region (21,27), and does not fall under a conductive material such as a layer of polysilicon (22,28) or an interconnect structure (23,29).
REFERENCES:
patent: 4949162 (1990-08-01), Tamaki et al.
patent: 4980311 (1990-12-01), Namose
patent: 5278105 (1994-01-01), Eden et al.
patent: 5290396 (1994-03-01), Schoenborn et al.
patent: 5350941 (1994-09-01), Madan
patent: 5374583 (1994-12-01), Lur et al.
patent: 5399389 (1995-03-01), Hieber et al.
patent: 5466636 (1995-11-01), Cronin et al.
patent: 5498565 (1996-03-01), Gocho et al.
Wolf, S. "Silicon Processing for the VLSI Era:vol. 2, Process Integration", Lattice Press, 1990, p. 54.
Dhar Rajive
Gilbert Percy V.
Iyer Subramoney
Kemp Kevin
Smith Bradley P.
Fourson George
Motorola Inc.
Witek Keith E.
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