Integrated circuit having a coplanar solder ball contact array

Details Integrated circuit having a coplanar solder ball contact array Integrated circuit having a coplanar solder ball contact array

1994-02-04

1995-07-25

Heinrich, Samuel M.

Metal fusion bonding

Process

Preplacing solid filler

228106, 2281805, H01L 21603

Patent

active

054354820

ABSTRACT:
An integrated circuit includes a plurality of solder balls arrayed on the bottom surface of a package of the integrated circuit. These solder balls provide for surface mounting of the integrated circuit to a circuit board by solder reflow. The array of solder balls can be planarized so that each of the plural solder balls participate in defining a truly planar solder ball contact array for the integrated circuit package. Methods of manufacturing the integrated circuit with a package having planarized solder balls in an array dependent from a bottom surface thereof are set forth. The truly planarized solder ball contact array of the integrated circuit package affords nearly absolute reliability in forming of surface-mount electrical connections between the integrated circuit package and the circuit board on which the package is to mount. Additionally, the planarized solder ball contacts locally compensate individually for warpage of the integrated circuit package by variation in the individual dimensions of dependency of each solder ball below the bottom surface of the package.

REFERENCES:
patent: 2366935 (1945-01-01), Schmid
patent: 4521995 (1985-06-01), Sekiya
patent: 4603466 (1986-08-01), Morley
patent: 4661192 (1987-04-01), McShane
patent: 4693036 (1987-09-01), Mori
patent: 4752027 (1988-06-01), Gschwend
patent: 5167361 (1992-12-01), Liebman et al.

Affiliated with

Also associated with

Rating

Integrated circuit having a coplanar solder ball contact array does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated circuit having a coplanar solder ball contact array, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit having a coplanar solder ball contact array will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-734930