Integrated circuit ground system

Details Integrated circuit ground system Integrated circuit ground system

2007-01-30

2007-01-30

Nguyen, Hoang V. (Department: 2821)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For high frequency device

C361S782000, C343S853000

Reexamination Certificate

active

10836875

ABSTRACT:
An integrated circuit ground system includes an integrated circuit (IC) ground connection, first and second IC package pins, first and second printed circuit board (PCB) pads, a PCB ground connection, and a resonant circuit. The IC ground connection is fabricated on a substrate of an integrated circuit. The first IC package pin is operably coupled to the IC ground connection via a first bond wire. The second IC package pin is operably coupled to the IC ground connection via a second bond wire. The second PCB pad is operably coupled to the second IC package pin to provide a low impedance DC ground connection for the integrated circuit to the printed circuit board. The resonant circuit is operably coupling the first IC package pin to the first PCB pad, wherein the resonant circuit is tuned to resonant with the first bond wire at high frequency range to provide a low impedance AC ground connection for the integrated circuit to the printed circuit board within the high frequency range.

REFERENCES:
patent: 6496382 (2002-12-01), Ferguson et al.
patent: 6664935 (2003-12-01), Thompson et al.
patent: 6798287 (2004-09-01), Wu et al.

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