Integrated circuit for directly attaching to a glass substrate a

Details Integrated circuit for directly attaching to a glass substrate a Integrated circuit for directly attaching to a glass substrate a

1996-09-06

1998-01-06

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

257783, 257668, 361760, H01L 2348, H05K 702

Patent

active

057058555

ABSTRACT:
An integrated circuit (230) for attaching to a glass substrate (225) includes an integrated circuit die (350) having circuitry formed thereon. The integrated circuit (230) has cavities (380) formed in a first surface, and metal layers (370) formed adjacent to the integrated circuit die (350) and within the cavities (380) are coupled to the circuitry. Conductive bumps (260), which are formed from a material that adheres to glass, are deposited within the cavities (380) and electrically coupled to the circuitry via the metal layers (370).

REFERENCES:
patent: 5329423 (1994-07-01), Scholz
patent: 5384952 (1995-01-01), Matsui
patent: 5393696 (1995-02-01), Koh et al.
"Electronic Packaging and Interconnection Handbook"; pp. 1.40-1.41; C. Harper.

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