Integrated circuit for communications modules

Details Integrated circuit for communications modules Integrated circuit for communications modules

2011-08-16

2011-08-16

Tran, Dzung D (Department: 2613)

Optical communications

Optical transceiver

C398S138000, C398S164000

Reexamination Certificate

active

08000608

ABSTRACT:
An integrated circuit product, for bidirectional communication, has two inputs and two outputs. The first input is located on a first edge of the integrated circuit product. The first output is located on a second edge of the integrated circuit product, the second edge being located adjacent to the first edge. The second input is located on a third edge of the integrated circuit product, the third edge being opposite the first edge. The second output is located on a fourth edge of the integrated circuit product, the fourth edge being opposite the second edge. The integrated circuit product can be mounted diagonally in a transceiver module, allowing straight signals paths from the inputs and outputs of the integrated circuit product to the corresponding inputs and outputs of the transceiver module. The inputs and outputs of the integrated circuit product can be located in the respective centre regions of their respective edges, so that connection pads of the integrated circuit within the integrated circuit product can be connected to the package landings of the integrated circuit product by means of the shortest available bond wires.

REFERENCES:
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patent: 7224910 (2007-05-01), Sherazi et al.
patent: 2001/0030789 (2001-10-01), Jiang et al.
patent: 2006/0094222 (2006-05-01), Wong et al.
patent: 2009/0003761 (2009-01-01), Matsuoka et al.
Vitesse Semiconductor Corporation. “Vitesse. SFP PRO™ Chipset and Reference Design.” Oct. 2004; 1-19.

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