Integrated circuit fabrication method

Details Integrated circuit fabrication method Integrated circuit fabrication method

1992-12-16

1994-05-17

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437231, 437238, 148DIG17, 148DIG158, H01L 21302

Patent

active

053127803

ABSTRACT:
A method for forming an anti-reflective coating useful in the fabrication of integrated circuits is discussed. Applicants have found that preheating semiconductor wafers prior to the application of amorphous silicon anti-reflective coatings tends to reduce undesirable particulates which may attach to the wafer. The process is illustratively performed in a Varian 3180 machine having four stations. Illustratively, the wafer may be preheated between 70.degree. C. and 175.degree. C. prior to and during the sputter deposition of an amorphous silicon anti-reflective coating.

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