Integrated circuit employing dummy conductors for planarity

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357 45, 357 71, H01L 2348, H01L 2944, H01L 2952, H01L 2960

Patent

active

049165143

ABSTRACT:
An integrated circuit having improved planarity includes a substrate, a plurality of transistors integrated into a top surface of the substrate, and a plurality of insulating layers over the top surface which are interleaved with respective sets of signal conductors. These signal conductors are spaced apart on the insulating layers and are routed through holes in the insulating layers to the transistors in order to carry signals to and from the transistors. Also, in accordance with the invention, the integrated circuit further includes dummy conductors on the insulating layers in the spaces between the signal conductors. These dummy conductors are open circuited and consequently carry no signals. Their function is purely mechanical; and specifically, they function to partially fill the spaces between the signal conductors such that an overlying insulating layer can be formed without peaks and valleys. For ease of fabrication, these dummy conductors are formed with the same mask and by the same steps as the signal conductors; and thus they are of the same material and have the same thickness as the signal conductors.

REFERENCES:
patent: 3634927 (1972-01-01), Neale et al.
patent: 4199778 (1980-04-01), Masuhara et al.
patent: 4322736 (1982-03-01), Sasaki et al.
patent: 4484212 (1984-11-01), Komatsu et al.
patent: 4500906 (1985-02-01), Ohno et al.

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