Integrated circuit, electronic component chip removal and replac

Details Integrated circuit, electronic component chip removal and replac Integrated circuit, electronic component chip removal and replac

1994-11-03

1997-02-04

Heinrich, Samuel M.

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Plural discrete workpieces

228 9, 228 495, 269903, B23K 304

Patent

active

055989659

ABSTRACT:
A electronic chip removal and replacement system to be used to remove and replace a surface mounted or edge connected electronic chip from a circuit board, the system including a heater assembly having a heater unit which produces a quantity of heat, thereby heating an air flow which passes thereover to produce heated air which exits the heater assembly through an outlet nozzle. The hot air flow is applied to the electronic chip in a specific controlled pattern as directed through a microprocessor which directs a timed and ramped increase and decrease of a temperature of the heater unit in accordance with a specific type of chip being heated. Further, the microprocessor is structured such that it can be disengaged remotely whereby only the heater unit is shut down and not the remainder of the system including the air flow over the heater unit, thereby allowing the heater unit to cool down between uses and facilitating ramped up heating in accordance with a specific ramped heating profile corresponding the specific type of electronic chip being replaced or removed.

REFERENCES:
patent: 4569473 (1986-02-01), Guiliano
patent: 4659004 (1987-04-01), Fridman
patent: 4752025 (1988-06-01), Stach et al.
patent: 4767047 (1988-08-01), Todd et al.
patent: 4799617 (1989-01-01), Friedman
patent: 4832249 (1989-05-01), Ehler
patent: 5340011 (1994-08-01), Sanchez
Surface Mount Technology, "How to Use Integral Vision and Reflow for Placement of fine Pitch SMCs", pp. 31,32, Feb. 1987.

Affiliated with

Also associated with

Rating

Integrated circuit, electronic component chip removal and replac does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated circuit, electronic component chip removal and replac, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit, electronic component chip removal and replac will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-672355