Integrated circuit edge protection method and apparatus

Details Integrated circuit edge protection method and apparatus Integrated circuit edge protection method and apparatus

2008-05-13

2008-05-13

Potter, Roy (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S778000

Reexamination Certificate

active

07372134

ABSTRACT:
An apparatus, method, and system for providing a mechanical divider adapted to shield at least a portion of an active surface of an integrated circuit from out-gassing from underfill material. The mechanical divider is attached to a mounting substrate. The underfill material is dispensed on the mounting substrate. The integrated circuit is placed on both the mechanical divider and on the underfill material after the mechanical divider has been at least partially cured. The mechanical divider may include a base surface adapted to contact the mounting substrate, a lower wall surface extending upwardly from the base surface, an upper wall surface adapted to abut a side wall of the integrated circuit, and a ledge surface extending between the lower wall surface and the upper wall surface, the ledge surface adapted to contact at least a portion of the active surface of the integrated circuit.

REFERENCES:
patent: 5585671 (1996-12-01), Nagesh et al.
patent: 6703299 (2004-03-01), Shi et al.
patent: 7148560 (2006-12-01), Lee et al.
patent: 2004/0004292 (2004-01-01), Hsieh et al.

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