Integrated circuit disassembly apparatus

Details Integrated circuit disassembly apparatus Integrated circuit disassembly apparatus

1991-10-28

1992-10-06

Seidel, Richard K.

Metal fusion bonding

Metallic heat applicator

228 55, 228 19, 228264, 219231, B23K 302, B23K 1018

Patent

active

051524481

ABSTRACT:
To effect disassembly of components relative to an integrated circuit board, the circuit board and its typical construction, including the soldering of the various components projected through the circuit board, is effected by an anvil, including a plurality of anvil bores, wherein the anvil is heated and each anvil bore is accordingly heated effecting the elimination of the associated soldering joints of each projecting tip of an associated electrical component directed through the circuit board. The apparatus further includes a metallic brush member arranged for securement to an associated heating member or gun to effect the cleaning and removal of solder residue remaining on the circuit board. Further, various anvil sizes are provided to accommodate various circuit board patterns and may be provided in a kit form in a single unitary container.

REFERENCES:
patent: 3050612 (1962-08-01), Eversole
patent: 3084649 (1963-04-01), Parstorfer
patent: 3813023 (1974-05-01), Auray et al.
patent: 3923002 (1975-12-01), Vanyi
patent: 4720036 (1988-01-01), Lison et al.
patent: 4769083 (1988-09-01), Tiritilli

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