Integrated circuit die for wire bonding and flip-chip mounting

Details Integrated circuit die for wire bonding and flip-chip mounting Integrated circuit die for wire bonding and flip-chip mounting

2005-06-22

2009-06-02

Cao, Phat X (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S738000, C257S780000

Reexamination Certificate

active

07541674

ABSTRACT:
An integrated circuit die carries conductive pads and thereon, the larger pads being suitable for flip-chip assembly and the smaller pads being suitable for wire bond assembly. The pitch between pads is at least the minimum required for flip-chip assembly, whereas the pitch between each of pads and the adjacent pad or pads is at least the minimum required for wire bond assembly. For wire bond assembly a passivation layer exposing all pads is provided, whereas for flip-chip assembly a passivation layer exposes only certain pads so that conductive bumps may be provided. The provision of pads complying with the minimum spacing requirements for both flip-chip and wire bond assembly enables a “dual purpose” (e.g. one set of pads being for normal production and another set for testing purposes) die to be produced without any increase in die size.

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Parent case U.S. Appl. No. 09/639,288, filed Aug. 15, 2000, entitled “Improvements in or Relating to Integrated Circuit Dies”; to Ross Addinall, et al., allowed on Apr. 7, 2005.

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