Integrated circuit die configuration for packaging

Details Integrated circuit die configuration for packaging Integrated circuit die configuration for packaging

2004-10-29

2008-03-11

Wilczewski, M. (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S107000, C257S723000, C257S730000, C257S773000

Reexamination Certificate

active

07341887

ABSTRACT:
Integrate circuit die terminal arrangements and configurations for mounting an integrate circuit die on a package substrate to reduce package transmission paths. In one embodiment, terminals for signals sensitive to trace length outside a die are arranged at the corners of the die. The die is mounted on a package substrate in an angle with respect to a package substrate to point the corners of the die at the edges of the package substrate to reduce trace length outside the die. The center of the die may or may not coincide with the center of the substrate. In one embodiment, when compare to a centered, non-rotated die mounting position, mounting a die with corners pointing at the edges of the package substrate does not cause significant differences in substrate warpage.

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