Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2006-04-18
2006-04-18
Parekh, Nitin (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S690000, C257S773000, C257S786000
Reexamination Certificate
active
07030479
ABSTRACT:
An integrated circuit die and/or package. An apparatus is described having a substrate with a central region and an outer region. A first plurality of electrical connections is spaced apart by a first distance on the outer region of the substrate. A second plurality of electrical connections is spaced apart by a second distance, smaller than the first distance, on the central region of the substrate.
REFERENCES:
patent: 4495377 (1985-01-01), Johnson et al.
patent: 5089881 (1992-02-01), Panicker
patent: 5091822 (1992-02-01), Takashima
patent: 5309024 (1994-05-01), Hirano
patent: 5324985 (1994-06-01), Hamada et al.
patent: 5463191 (1995-10-01), Bell et al.
patent: 5468994 (1995-11-01), Pendse
patent: 5491364 (1996-02-01), Brandenburg et al.
patent: 5686699 (1997-11-01), Chu et al.
patent: 5686764 (1997-11-01), Fulcher
patent: 5702256 (1997-12-01), Severn
patent: 5713744 (1998-02-01), Laub
patent: 5729894 (1998-03-01), Rostoker et al.
patent: 5952726 (1999-09-01), Liang
International Search Report PCT/US 00/14904.
Bhattacharyya Bidyut K.
Siu William M.
Intel Corporation
Parekh Nitin
LandOfFree
Integrated circuit die and/or package having a variable... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Integrated circuit die and/or package having a variable..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit die and/or package having a variable... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3570251