Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2005-02-01
2005-02-01
Chang, Richard (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S846000, C427S097100, C427S099300
Reexamination Certificate
active
06848177
ABSTRACT:
An electronic assembly is assembled by stacking two or more integrated circuit dies on top of one another. Prior to singulation, an opening is laser-drilled into an upper die, and subsequently filled with a conductive member. The conductive member is located on a lower die and interconnects integrated circuits of the upper and lower dies. Laser-drilling allows for faster throughput when compared to, for example, etching, especially if a small number of openings has to be formed. The opening is laser-drilled from an upper surface of the upper die all the way through the die, which allows for the use of alignment marks on an upper surface of the upper die.
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Atwood Greg
Chiang Chien
Natarajan Bala
Rao Valluri R.
Swan Johanna M.
Blakely , Sokoloff, Taylor & Zafman LLP
Chang Richard
Intel Corporation
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