Integrated circuit devices, edge seals therefor

Details Integrated circuit devices, edge seals therefor Integrated circuit devices, edge seals therefor

2007-06-26

2007-06-26

Zarneke, David A. (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Physical configuration of semiconductor

With peripheral feature due to separation of smaller...

C257SE23137

Reexamination Certificate

active

11002098

ABSTRACT:
An edge seal for a chip with integrated circuits. A first metal line extends along a periphery of the chip, with a first inter-metal dielectric layer on the first metal line. A second metal line overlies the first inter-metal dielectric layer and extends along the periphery of the chip. A plurality of first metal plugs in the first inter-metal dielectric layer connects the first metal line and the second metal line and at least one first metal wall in the first inter-metal dielectric layer is laterally adjacent to a periphery of the first metal line.

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