Integrated circuit device with multiple chips in one package

Electricity: measuring and testing – Measuring – testing – or sensing electricity – per se – With rotor

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C324S763010, C258S005000, C258S005000, C258S005000

Reexamination Certificate

active

11036980

ABSTRACT:
The integrated circuit device includes a memory chip and a logic chip. The memory chip has memory I/O pads and test pads. The test pads are placed in line at the position outer than memory I/O pads and larger than the memory I/O pads. The logic chip has logic COC I/O pads. The logic COC I/O pads are connected to the memory I/O pads.

REFERENCES:
patent: 5734199 (1998-03-01), Kawakita et al.
patent: 6369407 (2002-04-01), Hikita et al.
patent: 6392292 (2002-05-01), Morishita
patent: 6392304 (2002-05-01), Butler
patent: 6448636 (2002-09-01), Suenaga et al.
patent: 6456101 (2002-09-01), Dumbri
patent: 6538264 (2003-03-01), Corbett et al.
patent: 6548907 (2003-04-01), Yamada et al.
patent: 6620633 (2003-09-01), Hembree et al.
patent: 6630685 (2003-10-01), Lunde
patent: 6683374 (2004-01-01), Goller et al.
patent: 6756803 (2004-06-01), Miura et al.
patent: 6815712 (2004-11-01), Kline
patent: 6831294 (2004-12-01), Nishimura et al.
patent: 6833626 (2004-12-01), Kajiwara et al.
patent: 6858941 (2005-02-01), Ference et al.
patent: 6881593 (2005-04-01), Le et al.
patent: 6914259 (2005-07-01), Sakiyama et al.
patent: 6940093 (2005-09-01), Eldridge et al.
patent: 7019407 (2006-03-01), Chen et al.
patent: 7104804 (2006-09-01), Batinovich
patent: 2003/0151047 (2003-08-01), Corbett et al.
patent: 2005/0030055 (2005-02-01), Tran et al.
patent: 2007/0290363 (2007-12-01), Kyung
patent: 04-336442 (1992-11-01), None
patent: 06-302768 (1994-10-01), None
patent: 2000-227457 (2000-08-01), None
patent: 2003-068972 (2003-03-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Integrated circuit device with multiple chips in one package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated circuit device with multiple chips in one package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit device with multiple chips in one package will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3922818

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.