Integrated circuit device with multiple chips in one package

Details Integrated circuit device with multiple chips in one package Integrated circuit device with multiple chips in one package

2008-07-15

2008-07-15

Patel, Paresh (Department: 2829)

Electricity: measuring and testing

Measuring, testing, or sensing electricity, per se

With rotor

C324S763010, C258S005000, C258S005000, C258S005000

Reexamination Certificate

active

07400134

ABSTRACT:
The integrated circuit device includes a memory chip and a logic chip. The memory chip has memory I/O pads and test pads. The test pads are placed in line at the position outer than memory I/O pads and larger than the memory I/O pads. The logic chip has logic COC I/O pads. The logic COC I/O pads are connected to the memory I/O pads.

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