Semiconductor device manufacturing: process – Repair or restoration
Reexamination Certificate
2011-05-17
2011-05-17
Loke, Steven (Department: 2829)
Semiconductor device manufacturing: process
Repair or restoration
C438S128000, C438S130000, C438S586000, C438S618000, C257S208000, C257S209000
Reexamination Certificate
active
07943400
ABSTRACT:
An semiconductor device having a plurality of fabrication layers. A first region of a first fabrication layer of the semiconductor device is revised. To signal the revision, a connectivity structure in a second region of the first fabrication layer is omitted to interrupt an otherwise continuous signal path that extends through a plurality of interconnection layers of the semiconductor device.
REFERENCES:
patent: 4447887 (1984-05-01), Imazeki et al.
patent: 4933903 (1990-06-01), Nakaizumi
patent: 5225702 (1993-07-01), Chatterjee
patent: 5294812 (1994-03-01), Hashimoto et al.
patent: 5453384 (1995-09-01), Chatterjee
patent: 5517051 (1996-05-01), Chatterjee
patent: 5723876 (1998-03-01), Ray
patent: 6114882 (2000-09-01), Flynn
patent: 6446017 (2002-09-01), Skidmore
patent: 6446248 (2002-09-01), Solomon et al.
patent: 6477079 (2002-11-01), Kaneko et al.
patent: 6622102 (2003-09-01), Skidmore
patent: 6629309 (2003-09-01), Allen, III
patent: 6750479 (2004-06-01), Haag
patent: 6904124 (2005-06-01), Staver et al.
patent: 7215004 (2007-05-01), Nataraj
patent: 7589362 (2009-09-01), Argyres et al.
patent: 2002/0085163 (2002-07-01), Park et al.
patent: 2002/0152043 (2002-10-01), Skidmore
patent: 2003/0077896 (2003-04-01), Saito et al.
patent: 2003/0227320 (2003-12-01), Davis
patent: 2004/0251470 (2004-12-01), Catalasan et al.
patent: 2004/0251472 (2004-12-01), Catalasan et al.
patent: 2004/0253778 (2004-12-01), Catalasan et al.
patent: 2009/0250820 (2009-10-01), Argyres et al.
patent: 1341214 (2003-09-01), None
patent: 01-305495 (1989-12-01), None
patent: WO 2004/021022 (2004-03-01), None
patent: WO 2004/021022 (2004-03-01), None
U.S. Appl. No. 11/764,157, filed Jun. 15, 2007, Argyres et al.
U.S. Appl. No. 12/484,076, filed Jun. 12, 2009, Argyres et al.
Final Office Action mailed Aug. 1, 2006 in U.S. Appl. No. 10/883,161 6 pages.
Non-Final Office Action mailed Jan. 10, 2006 in U.S. Appl. No. 10/883,161 6 pages.
Notice of Allowance mailed Jun. 1, 2009 in U.S. Appl. No. 11/764,157 6 pages.
Notice of Allowance mailed Jan. 11, 2007 in U.S. Appl. No. 10/883,161 4 pages.
Loke Steven
Mahamedi Paradice Kreisman LLP
NetLogic Microsystems, Inc.
Whalen Daniel
LandOfFree
Integrated circuit device with electronically accessible... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Integrated circuit device with electronically accessible..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit device with electronically accessible... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2687023