Integrated circuit device packaging structure and packaging...

Details Integrated circuit device packaging structure and packaging... Integrated circuit device packaging structure and packaging...

2007-07-31

2007-07-31

Andújar, Leonardo (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

C257S434000, C438S116000

Reexamination Certificate

active

11073724

ABSTRACT:
A packaging structure suitable for an integrated circuit device receiving short-wavelength laser light is provided. A lead-mounted substrate is placed on the side of the light receiving surface of the integrated circuit device having a photo detecting part. The lead is electrically connected with the integrated circuit device via an electrode. The integrated circuit device and the substrate are encapsulated with an encapsulation section. The substrate has an opening at a position above the photo detecting part.

REFERENCES:
patent: 5786589 (1998-07-01), Segawa et al.
patent: 6188130 (2001-02-01), Ramirez et al.
patent: 6407456 (2002-06-01), Ball
patent: 6483652 (2002-11-01), Nakamura
patent: 6492699 (2002-12-01), Glenn et al.
patent: 6650006 (2003-11-01), Huang et al.
patent: 6661571 (2003-12-01), Shioda et al.
patent: 05-6989 (1993-01-01), None

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