Integrated circuit device package interconnect means

Details Integrated circuit device package interconnect means Integrated circuit device package interconnect means

1978-10-25

1980-09-30

Tolin, Gerald P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361403, 361410, 361414, 357 80, 339 17M, 339 18C, H05K 108

Patent

active

042259002

ABSTRACT:
An integrated circuit device package is disclosed wherein a pair of dielectric support structures are provided, each one having a pattern of electrical conductors for interconnecting integrated circuit devices disposed thereon. The electrical conductors have end portions terminating into a plurality of contact pads disposed on a first surface of the support structures. A first one of the pair of support structures has corresponding contact pads on a second, opposite surface of the support structure, each one of the contact pads on the first surface being electrically connected to a corresponding one of the contact pads on the second surface. A dielectric spacer having a plurality of electrical contact pins is disposed between the pair of support structures. One end of each pin is electrically connected to a corresponding one of the contact pads disposed on the second surface of the first one of such structures, and the other end of such contact pin is electrically connected to a corresponding one of the contact pins disposed on the first surface of the second one of the structures. The contact pins are relatively short and thereby provide a relatively short electrical interconnect for the integrated circuit devices, thereby reducing parasitic capacitances normally associated with electrical interconnects.

REFERENCES:
patent: T955008 (1977-02-01), Gregor
patent: 3403300 (1968-09-01), Horowitz
patent: 3646246 (1972-02-01), Olney, Jr.
patent: 3904934 (1975-09-01), Martin

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