Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate
2004-06-21
2008-08-12
Weiss, Howard (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
C257S686000, C257S707000, C257SE33075, C257SE23080
Reexamination Certificate
active
07411281
ABSTRACT:
Die-down array integrated circuit (IC) device packages with enhanced thermal, electrical, and input/output properties are presented. A die-down array IC device package includes a heat spreader having a central cavity. A first substrate surface is coupled to the heat spreader. A central opening through the substrate overlaps the central cavity. Alternatively, the heat spreader is formed by coupling a ring-shaped body to a planar heat spreader. The first substrate surface is coupled to the ring-shaped body and the substrate central opening overlaps a central opening through the ring-shaped body. An array of electrically conductive terminals is coupled to a second substrate surface. An IC die is mounted to the heat spreader within the central cavity. Bond pads on the die are coupled to corresponding bond pads on the substrate with a plurality of wire bonds. Electrically conductive bumps on the die are coupled to corresponding bond pads on an interposer.
REFERENCES:
patent: 3790866 (1974-02-01), Meyer et al.
patent: 4611238 (1986-09-01), Lewis et al.
patent: 5045921 (1991-09-01), Lin et al.
patent: 5065281 (1991-11-01), Hernandez et al.
patent: 5173766 (1992-12-01), Long et al.
patent: 5208504 (1993-05-01), Parker et al.
patent: 5216278 (1993-06-01), Lin et al.
patent: 5285352 (1994-02-01), Pastore et al.
patent: 5291062 (1994-03-01), Higgins, III
patent: 5294826 (1994-03-01), Marcantonio et al.
patent: 5366589 (1994-11-01), Chang
patent: 5394009 (1995-02-01), Loo
patent: 5397917 (1995-03-01), Ommen et al.
patent: 5397921 (1995-03-01), Karnezos
patent: 5409865 (1995-04-01), Karnezos
patent: 5433631 (1995-07-01), Beaman et al.
patent: 5438216 (1995-08-01), Juskey et al.
patent: 5474957 (1995-12-01), Urushima
patent: 5490324 (1996-02-01), Newman
patent: 5534467 (1996-07-01), Rostoker
patent: 5541450 (1996-07-01), Jones et al.
patent: 5552635 (1996-09-01), Kim et al.
patent: 5572405 (1996-11-01), Wilson et al.
patent: 5578869 (1996-11-01), Hoffman et al.
patent: 5583377 (1996-12-01), Higgins, III
patent: 5583378 (1996-12-01), Marrs et al.
patent: 5642261 (1997-06-01), Bond et al.
patent: 5648679 (1997-07-01), Chillara et al.
patent: 5650659 (1997-07-01), Mostafazadeh et al.
patent: 5650662 (1997-07-01), Edwards et al.
patent: 5691567 (1997-11-01), Lo et al.
patent: 5717252 (1998-02-01), Nakashima et al.
patent: 5736785 (1998-04-01), Chiang et al.
patent: 5744863 (1998-04-01), Culnane et al.
patent: 5796170 (1998-08-01), Marcantonio
patent: 5798909 (1998-08-01), Bhatt et al.
patent: 5801432 (1998-09-01), Rostoker et al.
patent: 5835355 (1998-11-01), Dordi
patent: 5843808 (1998-12-01), Karnezos
patent: 5844168 (1998-12-01), Schueller et al.
patent: 5856911 (1999-01-01), Riley
patent: 5866949 (1999-02-01), Schueller
patent: 5883430 (1999-03-01), Johnson
patent: 5889321 (1999-03-01), Culnane et al.
patent: 5889324 (1999-03-01), Suzuki
patent: 5894410 (1999-04-01), Barrow
patent: 5895967 (1999-04-01), Stearns et al.
patent: 5901041 (1999-05-01), Davies et al.
patent: 5903052 (1999-05-01), Chen et al.
patent: 5905633 (1999-05-01), Shim et al.
patent: 5907189 (1999-05-01), Mertol
patent: 5907903 (1999-06-01), Ameen et al.
patent: 5920117 (1999-07-01), Sono et al.
patent: 5949137 (1999-09-01), Domadia et al.
patent: 5953589 (1999-09-01), Shim et al.
patent: 5972734 (1999-10-01), Carichner et al.
patent: 5976912 (1999-11-01), Fukutomi et al.
patent: 5977626 (1999-11-01), Wang et al.
patent: 5977633 (1999-11-01), Suzuki et al.
patent: 5982621 (1999-11-01), Li
patent: 5986340 (1999-11-01), Mostafazadeh et al.
patent: 5986885 (1999-11-01), Wyland
patent: 5998241 (1999-12-01), Niwa
patent: 5999415 (1999-12-01), Hamzehdoost
patent: 6002147 (1999-12-01), Iovdalsky et al.
patent: 6002169 (1999-12-01), Chia et al.
patent: 6011304 (2000-01-01), Mertol
patent: 6011694 (2000-01-01), Hirakawa
patent: 6020637 (2000-02-01), Karnezos
patent: 6028358 (2000-02-01), Suzuki
patent: 6034427 (2000-03-01), Lan et al.
patent: 6040984 (2000-03-01), Hirakawa
patent: 6057601 (2000-05-01), Lau et al.
patent: 6060777 (2000-05-01), Jamieson et al.
patent: 6064111 (2000-05-01), Sota et al.
patent: 6069407 (2000-05-01), Hamzehdoost
patent: 6077724 (2000-06-01), Chen
patent: 6084297 (2000-07-01), Brooks et al.
patent: 6084777 (2000-07-01), Kalidas et al.
patent: 6114761 (2000-09-01), Mertol et al.
patent: 6117797 (2000-09-01), Hembree
patent: 6122171 (2000-09-01), Akram et al.
patent: 6133064 (2000-10-01), Nagarajan et al.
patent: 6140707 (2000-10-01), Plepys et al.
patent: 6160705 (2000-12-01), Stearns et al.
patent: 6162659 (2000-12-01), Wu
patent: 6163458 (2000-12-01), Li
patent: 6166434 (2000-12-01), Desai et al.
patent: 6184580 (2001-02-01), Lin
patent: 6201300 (2001-03-01), Tseng et al.
patent: 6207467 (2001-03-01), Vaiyapuri et al.
patent: 6212070 (2001-04-01), Atwood et al.
patent: 6242279 (2001-06-01), Ho et al.
patent: 6246111 (2001-06-01), Huang et al.
patent: 6278613 (2001-08-01), Fernandez et al.
patent: 6288444 (2001-09-01), Abe et al.
patent: 6313521 (2001-11-01), Baba
patent: 6313525 (2001-11-01), Sasano
patent: 6347037 (2002-02-01), Iijima et al.
patent: 6362525 (2002-03-01), Rahim
patent: 6365980 (2002-04-01), Carter, Jr. et al.
patent: 6369455 (2002-04-01), Ho et al.
patent: 6380623 (2002-04-01), Demore
patent: 6395582 (2002-05-01), Sohn et al.
patent: 6462274 (2002-10-01), Shim et al.
patent: 6472741 (2002-10-01), Chen et al.
patent: 6525942 (2003-02-01), Huang et al.
patent: 6528869 (2003-03-01), Glenn et al.
patent: 6528892 (2003-03-01), Caletka et al.
patent: 6541832 (2003-04-01), Coyle
patent: 6545351 (2003-04-01), Jamieson et al.
patent: 6552266 (2003-04-01), Carden et al.
patent: 6552428 (2003-04-01), Huang et al.
patent: 6552430 (2003-04-01), Perez et al.
patent: 6563712 (2003-05-01), Akram et al.
patent: 6583516 (2003-06-01), Hashimoto
patent: 6602732 (2003-08-01), Chen
patent: 6614660 (2003-09-01), Bai et al.
patent: 6617193 (2003-09-01), Toshio et al.
patent: 6657870 (2003-12-01), Ali et al.
patent: 6664617 (2003-12-01), Siu
patent: 6724071 (2004-04-01), Combs
patent: 6724080 (2004-04-01), Ooi et al.
patent: 2001/0001505 (2001-05-01), Schueller et al.
patent: 2001/0040279 (2001-11-01), Mess et al.
patent: 2001/0045644 (2001-11-01), Huang
patent: 2002/0053731 (2002-05-01), Chao et al.
patent: 2002/0072214 (2002-06-01), Yuzawa et al.
patent: 2002/0079562 (2002-06-01), Zhao et al.
patent: 2002/0079572 (2002-06-01), Khan et al.
patent: 2002/0096767 (2002-07-01), Cote et al.
patent: 2002/0098617 (2002-07-01), Lee et al.
patent: 2002/0109226 (2002-08-01), Khan et al.
patent: 2002/0135065 (2002-09-01), Zhao et al.
patent: 2002/0171144 (2002-11-01), Zhang et al.
patent: 2002/0180040 (2002-12-01), Camenforte et al.
patent: 2002/0185717 (2002-12-01), Eghan et al.
patent: 2002/0185720 (2002-12-01), Khan et al.
patent: 2002/0185722 (2002-12-01), Zhao et al.
patent: 2002/0185734 (2002-12-01), Zhao et al.
patent: 2002/0185750 (2002-12-01), Khan et al.
patent: 2002/0190361 (2002-12-01), Zhao et al.
patent: 2002/0190362 (2002-12-01), Khan et al.
patent: 2003/0057550 (2003-03-01), Zhao et al.
patent: 2003/0111726 (2003-06-01), Khan et al.
patent: 2003/0137057 (2003-07-01), Honda
patent: 2003/0138613 (2003-07-01), Thoman et al.
patent: 2003/0146503 (2003-08-01), Khan et al.
patent: 2003/0146506 (2003-08-01), Khan et al.
patent: 2003/0146509 (2003-08-01), Zhao et al.
patent: 2003/0146511 (2003-08-01), Zhao et al.
patent: 2003/0179549 (2003-09-01), Zhong et al.
patent: 2003/0179556 (2003-09-01), Zhao et al.
patent: 2004/0072456 (2004-04-01), Dozier, II et al.
patent: 2004/0113284 (2004-06-01), Zhao et al.
patent: 0 573 297 (1993-12-01), None
patent: 0 504 411 (1998-06-01), None
patent: 2 803 098 (2001-06-01), None
patent: 61-49446 (1986-03-01), None
patent: 7-283336 (1995-10-01), None
patent: 10-50877 (1998-02-01), None
patent: 10-189835 (1998-07-01), None
patent: 10-247702 (1998-09-01), None
patent: 10-247703 (1998-09-01), None
patent: 11-17064 (1999-01-01), None
patent: 11-102989 (1999-04-01), None
patent: 2000-286294 (2000-10-01), None
patent: 2001-68512 (2001-03-01), None
patent: 383908 (2000-03-01), None
pat
Broadcom Corporation
Sterne Kessler Goldstein & Fox PLLC
Trinh Hoa B
Weiss Howard
LandOfFree
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