Integrated circuit device installed structure and...

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation

Reexamination Certificate

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C257S680000

Reexamination Certificate

active

06924540

ABSTRACT:
A packaging structure suitable for an integrated circuit device receiving short-wavelength laser light is provided. The integrated circuit device having a photo detecting part, leads and wires for connection therebetween are encapsulated in an encapsulation section. A recess is formed on the light incident surface of the encapsulation section above the photo detecting part, to thin the encapsulation section on the surface of the photo detecting part and thereby reduce the energy of light absorbed by the encapsulation section.

REFERENCES:
patent: 5534725 (1996-07-01), Hur
patent: 6261870 (2001-07-01), Haehn et al.
patent: 6379988 (2002-04-01), Peterson et al.
patent: 04-9381 (1992-02-01), None
patent: 2769255 (1998-04-01), None

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