Integrated circuit device including tunable substrate...

Details Integrated circuit device including tunable substrate... Integrated circuit device including tunable substrate...

2008-03-07

2011-11-22

Kim, Ahshik (Department: 2876)

Registers

Records

Conductive

C235S451000

Reexamination Certificate

active

08061621

ABSTRACT:
An integrated circuit device and method. A substrate having contacts has a plurality of capacitors thereon. A plurality of fusible links selectively connect the plurality of capacitors to one another and selected ones of the capacitors to the contacts. In this manner, for example, the capacitance value can be adjusted to tune an antenna mounted on the substrate during testing of the integrated circuit device.

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patent: 2007/0187804 (2007-08-01), El Rai et al.
patent: 2007051571 (2007-05-01), None
Brunnbauer et al., Embedded Wafer Level Ball Grid Array (eWLB), Electronics Packaging Technology Conference, 2006, pp. 1-5.

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