Integrated circuit device including means for facilitating conne

Details Integrated circuit device including means for facilitating conne Integrated circuit device including means for facilitating conne

1991-06-05

1994-01-25

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Wire contact, lead, or bond

340573, 342 51, 606116, A01K 1100, G01S 1380, H01L 2940

Patent

active

052818551

ABSTRACT:
A method and apparatus for facilitating interconnection of lead wires to an integrated circuit including the provision of an additional protective layer of insulation to the top of an integrated circuit chip or die and the provision of enlarged plated electrodes to the surface of the additional insulation to form enhanced bonding pads, such pads being electrically connected through the protective layers to the normal bonding pads of the integrated circuit device. The enhanced bonding pads are made of a soft conductive metal such that external wires to be attached thereto can be bonded to the pads using a thermal compression bonding technique.

REFERENCES:
patent: 3609741 (1971-09-01), Miller
patent: 4001822 (1977-01-01), Sterzer
patent: 4017886 (1977-04-01), Tomono et al.
patent: 4273859 (1981-06-01), Mones et al.
patent: 4507852 (1985-04-01), Karulkar
patent: 4805232 (1989-02-01), Ma
patent: 4857893 (1989-08-01), Carroll
patent: 4984061 (1991-01-01), Matsumoto
patent: 4990993 (1991-02-01), Tsurumaru
patent: 4992794 (1991-02-01), Brouwers
patent: 5025550 (1991-06-01), Zirbes et al.
patent: 5050292 (1991-09-01), Zirbes et al.
patent: 5136271 (1992-08-01), Nishioka et al.
patent: 5142698 (1992-08-01), Koga et al.

Affiliated with

Also associated with

Rating

Integrated circuit device including means for facilitating conne does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated circuit device including means for facilitating conne, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit device including means for facilitating conne will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-730073