Integrated circuit device including a contactless integrated...

Registers – Records – Conductive

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Reexamination Certificate

active

07926728

ABSTRACT:
Embodiments provide an integrated circuit device including a contactless integrated circuit inlay. The device includes a substrate, an integrated circuit coupled to the substrate, and a coil electrically coupled to the integrated circuit and coupled to the substrate. The coil includes a first conductive line disposed in multiple turns on the substrate and a second conductive line disposed in multiple turns on the substrate.

REFERENCES:
patent: 5337063 (1994-08-01), Takahira
patent: 5436441 (1995-07-01), Inoue
patent: 5999409 (1999-12-01), Ando et al.
patent: 6373708 (2002-04-01), Ando et al.
patent: 6375083 (2002-04-01), Fries et al.
patent: 6622921 (2003-09-01), Altwasser et al.
patent: 6898070 (2005-05-01), Korony et al.
patent: 7202790 (2007-04-01), Copeland et al.
patent: 19633923 (1998-02-01), None
patent: 19820234 (1999-11-01), None
patent: 10056148 (2002-05-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Integrated circuit device including a contactless integrated... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated circuit device including a contactless integrated..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit device including a contactless integrated... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2681716

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.