Integrated circuit device having signal wiring structure of ultr

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

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257753, 257275, 257276, 257296, H01L 2710, H01L 2715, H01L 2348, H01L 2946

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active

053844866

ABSTRACT:
An integrated circuit device has a substrate, a plurality of circuit elements or units arranged on the substrate and having terminals, a plurality of signal lines connected between the terminals of the circuit elements or units, or between the terminals and external connection terminals, and an alternating current ground line provided close to the signal lines to determine a transmission characteristic of the signal lines, the alternating current ground line including a high-potential direct current power source line and a low-potential direct current power source line, the high-potential direct current power source line and the low-potential direct current power source line being vertically separated by a dielectric layer.

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patent: 5112761 (1992-05-01), Matthews
Patent Abstracts of Japan, vol. 10, No. 347, Nov. 21, 1986.
Patent Abstracts of Japan, vol. 12, No. 9, Jan. 12, 1988.

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