Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2008-03-18
2008-03-18
Zarneke, David (Department: 2891)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C438S123000, C438S106000
Reexamination Certificate
active
11358268
ABSTRACT:
An integrated circuit device includes a semiconductor component coupled with a lead frame, and an integrated circuit package encompassing at least a portion of the semiconductor component. The package has a first surface and a second surface, and side surfaces, where the first surface is opposite the second surface. A parting line of the integrated circuit package is offset toward the second surface of the package, where the first surface optionally comprises the bottom surface of the package. The first surface of the package has one or more recessed areas.
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Baerlocher Cary J.
Schwab Matt E.
Tandy William D.
Micro)n Technology, Inc.
Schwegman Lundberg & Woessner, P.A.
Wagner Jenny L.
Zarneke David
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