Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate
2006-08-22
2006-08-22
Owens, Douglas W (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
C257S678000, C257S787000
Reexamination Certificate
active
07095097
ABSTRACT:
An integrated circuit device includes a semiconductor component coupled with a lead frame, and an integrated circuit package encompassing at least a portion of the semiconductor component. The package has a first surface and a second surface, and side surfaces, where the first surface is opposite the second surface. A parting line of the integrated circuit package is offset toward the second surface of the package, where the first surface optionally comprises the bottom surface of the package. The first surface of the package has one or more recessed areas.
REFERENCES:
patent: 5150194 (1992-09-01), Brooks et al.
patent: 5214307 (1993-05-01), Davis
patent: 5463250 (1995-10-01), Nguyen et al.
patent: 5733800 (1998-03-01), Moden
patent: 5841194 (1998-11-01), Tsukamoto
patent: 5864175 (1999-01-01), Burns
patent: 5889318 (1999-03-01), Corisis
patent: 6002165 (1999-12-01), Kinsman
patent: 6015722 (2000-01-01), Banks et al.
patent: 6015955 (2000-01-01), Farooq et al.
patent: 6059917 (2000-05-01), Kyle
patent: 6111307 (2000-08-01), Corisis
patent: 6147374 (2000-11-01), Tanaka et al.
patent: 6204559 (2001-03-01), Lin et al.
patent: 6224711 (2001-05-01), Carden et al.
patent: 6274938 (2001-08-01), Ohuchi et al.
patent: 6285080 (2001-09-01), Bezama et al.
patent: 6326681 (2001-12-01), Murakami et al.
patent: 6384487 (2002-05-01), Smith
patent: 6396131 (2002-05-01), Kinsman et al.
patent: 6404062 (2002-06-01), Taniguchi et al.
patent: 6424027 (2002-07-01), Lamson et al.
patent: 6507100 (2003-01-01), Valluri et al.
patent: 6534852 (2003-03-01), Lin et al.
patent: 6552425 (2003-04-01), Yan et al.
patent: 0345809 (1995-08-01), None
patent: 2001-217364 (2001-08-01), None
patent: WO-01/78109 (2001-10-01), None
Baerlocher Cary J.
Schwab Matt E.
Tandy William D.
Micro)n Technology, Inc.
Owens Douglas W
Schwegman Lundberg Woessner & Kluth P.A.
LandOfFree
Integrated circuit device having reduced bow and method for... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Integrated circuit device having reduced bow and method for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit device having reduced bow and method for... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3715869