Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2008-03-18
2008-03-18
Zarneke, David (Department: 2891)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C438S123000, C438S106000
Reexamination Certificate
active
07344921
ABSTRACT:
An integrated circuit device includes a semiconductor component coupled with a lead frame, and an integrated circuit package encompassing at least a portion of the semiconductor component. The package has a first surface and a second surface, and side surfaces, where the first surface is opposite the second surface. A parting line of the integrated circuit package is offset toward the second surface of the package, where the first surface optionally comprises the bottom surface of the package. The first surface of the package has one or more recessed areas.
REFERENCES:
patent: 4639388 (1987-01-01), Ainsworth et al.
patent: 4841134 (1989-06-01), Hida et al.
patent: 5150194 (1992-09-01), Brooks et al.
patent: 5214307 (1993-05-01), Davis
patent: 5399902 (1995-03-01), Bickford et al.
patent: 5463250 (1995-10-01), Nguyen et al.
patent: 5733800 (1998-03-01), Moden
patent: 5841194 (1998-11-01), Tsukamoto
patent: 5864175 (1999-01-01), Burns
patent: 5889318 (1999-03-01), Corisis
patent: 6002165 (1999-12-01), Kinsman
patent: 6015722 (2000-01-01), Banks et al.
patent: 6015955 (2000-01-01), Farooq et al.
patent: 6059917 (2000-05-01), Kyle
patent: 6111307 (2000-08-01), Corisis
patent: 6147374 (2000-11-01), Tanaka et al.
patent: 6204559 (2001-03-01), Lin et al.
patent: 6224711 (2001-05-01), Carden et al.
patent: 6274938 (2001-08-01), Ohuchi et al.
patent: 6285080 (2001-09-01), Bezama et al.
patent: 6326681 (2001-12-01), Murakami et al.
patent: 6384487 (2002-05-01), Smith
patent: 6396131 (2002-05-01), Kinsman et al.
patent: 6404062 (2002-06-01), Taniguchi et al.
patent: 6424027 (2002-07-01), Lamson et al.
patent: 6444340 (2002-09-01), Jaffrey
patent: 6472747 (2002-10-01), Bazarjani et al.
patent: 6507100 (2003-01-01), Valluri et al.
patent: 6534852 (2003-03-01), Lin et al.
patent: 6552425 (2003-04-01), Yan et al.
patent: 6887740 (2005-05-01), Tandy et al.
patent: 7095097 (2006-08-01), Tandy et al.
patent: 7161236 (2007-01-01), Kuan et al.
patent: 2002/0100989 (2002-08-01), Jiang et al.
patent: 2002/0171142 (2002-11-01), Kinsman
patent: 2002/0171157 (2002-11-01), Soga et al.
patent: 2002/0190388 (2002-12-01), Eytcheson
patent: 2005/0023653 (2005-02-01), Tandy et al.
patent: 2005/0229552 (2005-02-01), Kuan et al.
patent: 2006/0244141 (2006-11-01), Kuan et al.
patent: 0345809 (1995-08-01), None
patent: 2001-217364 (2001-08-01), None
patent: WO-01/78109 (2001-10-01), None
“U.S. Appl. No. 09-648316 (Atty Ref 303.704US1) Non Final office action mailed May 8, 2002”, 12 pgs.
“U.S. Appl. No. 09-648316 (Atty Ref 303.704US1) Notice of allowance mailed Nov. 4, 2002”, 9 pgs.
“U.S. Appl. No. 09-648316 (Atty Ref 303.704US1) Response filed Aug. 7, 2002 to Non Final office action mailed May 8, 2002”, 7 pgs.
“U.S. Appl. No. 10-118580 (Atty Ref 303.769US1) Amendment and response filed May 2, 2005 to Final Office action mailed Mar. 2, 2005”, 19 pgs.
“U.S. Appl. No. 10-118580 (Atty Ref 303.769US1) Amendment and response under 37 CFR 1.312 filed Aug. 29, 2006”, 10 pgs.
“U.S. Appl. No. 10-118580 (Atty Ref 303.769US1) Final Office action mailed Mar. 2, 2005”, 27 pgs.
“U.S. Appl. No. 10-118580 (Atty Ref 303.769US1) Non-final Office action mailed May 2, 2003”, 17 pgs.
“U.S. Appl. No. 10-118580 (Atty Ref 303.769US1) Non-final Office action mailed Aug. 16, 2004”, 25 pgs.
“U.S. Appl. No. 10-118580 (Atty Ref 303.769US1) Non-final Office action mailed Aug. 19, 2005”, 23 pgs.
“U.S. Appl. No. 10-118580 (Atty Ref 303.769US1) Non-final Office action mailed Oct. 27, 2003”, 12 pgs.
“U.S. Appl. No. 10-118580 (Atty Ref 303.769US1) Notice of allowance mailed Feb. 27, 2006”, 8 pgs.
“U.S. Appl. No. 10-118580 (Atty Ref 303.769US1) Notice of allowance mailed Jun. 29, 2006”, 7 pgs.
“U.S. Appl. No. 10-118580 (Atty Ref 303.769US1) Notice of allowance mailed Oct. 10, 2006”, 7 pgs.
“U.S. Appl. No. 10-118580 (Atty Ref 303.769US1) Response and amendment filed Jul. 11, 2003 to Non-final office action mailed May 2, 2003”, 21 pgs.
“U.S. Appl. No. 10-118580 (Atty Ref 303.769US1) Response filed Apr. 27, 2004 to Non-final Office action mailed Oct. 27, 2003”, 14 pgs.
“U.S. Appl. No. 10-118580 (Atty Ref 303.769US1) Response filed Nov. 21, 2005 to Non-final Office action mailed Aug. 19, 2005”, 18 pgs.
“U.S. Appl. No. 10-118580 (Atty Ref 303.769US1) Response filed Dec. 16, 2004 to Non-final Office action mailed Aug. 16, 2004”, 28 pgs.
“U.S. Appl. No. 10-931369 (Atty Ref 303.704US3) Final office action mailed Jul. 14, 2005”, 7 pgs.
“U.S. Appl. No. 10-931369 (Atty Ref 303.704US3) Non-final office action mailed Jan. 26, 2005”, 7 pgs.
“U.S. Appl. No. 10-931369 (Atty Ref 303.704US3) Notice of allowance mailed Oct. 6, 2005”, 6 pgs.
“U.S. Appl. No. 10-931369 (Atty Ref 303.704US3) Response filed Apr. 26, 2005 to Non-final office action mailed Jan. 26, 2005”, 8 pgs.
“Application Ser. No. U.S. Appl. No. 10-412064 (Atty Ref 303.704US2) Final office action mailed Sep. 24, 2004”, 8 pgs.
“Application Ser. No. U.S. Appl. No. 10-412064 (Atty Ref 303.704US2) Non-final office action mailed Mar. 10, 2004”, 10 pgs.
“Application Ser. No. U.S. Appl. No. 10-412064 (Atty Ref 303.704US2) Notice of allowance mailed Dec. 21, 2004”, 7 pgs.
“Application Ser. No. U.S. Appl. No. 10-412064 (Atty Ref 303.704US2) Response filed Jun. 10, 2004 to Non-final office action mailed Mar. 10, 2004”, 12 pgs.
Baerlocher Cary J.
Schwab Matt E.
Tandy William D.
Micro)n Technology, Inc.
Schwegman Lundberg & Woessner, P.A.
Wagner Jenny L.
Zarneke David
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