Integrated circuit device having flexible leadframe

Details Integrated circuit device having flexible leadframe Integrated circuit device having flexible leadframe

2005-12-14

2009-06-02

Huynh, Andy (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S122000, C438S125000, C257S666000, C257S668000, C257S671000, C257S706000

Reexamination Certificate

active

07541220

ABSTRACT:
An integrated circuit device having a flexible leadframe, and techniques for fabricating the flexible leadframe and integrated circuit device, are provided. In one aspect of the invention, an integrated circuit device comprises a heat spreader having a top surface and a bottom surface. At least one integrated circuit die is attached to the top surface of the heat spreader. A flexible leadframe is also attached to the top surface of the heat spreader. The flexible leadframe has one or more flexible layers, including at least one flexible insulating layer. A plurality of electrically conductive traces are defined on the at least one flexible insulating layer.

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