Integrated circuit device having flexible leadframe

Details Integrated circuit device having flexible leadframe Integrated circuit device having flexible leadframe

2006-04-18

2006-04-18

Huynh, Andy (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S675000, C257S676000, C257S706000, C257S711000, C257S713000

Reexamination Certificate

active

07030472

ABSTRACT:
An integrated circuit device having a flexible leadframe, and techniques for fabricating the flexible leadframe and integrated circuit device, are provided. In one aspect of the invention, an integrated circuit device comprises a heat spreader having a top surface and a bottom surface. At least one integrated circuit die is attached to the top surface of the heat spreader. A flexible leadframe is also attached to the top surface of the heat spreader. The flexible leadframe has one or more flexible layers, including at least one flexible insulating layer. A plurality of electrically conductive traces are defined on the at least one flexible insulating layer.

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