Integrated circuit device having easily cleaned region between m

Details Integrated circuit device having easily cleaned region between m Integrated circuit device having easily cleaned region between m

1983-10-19

1985-01-15

Goldberg, Howard N.

Metal working

Method of mechanical manufacture

Electrical device making

174 52FP, 361386, H05K 334

Patent

active

044931450

ABSTRACT:
An integrated circuit device for realizing high integration density wherein a small size package called chip carrier (1) comprising a semiconductor integrated circuit element and providing connecting area at the perimeter of the rear side of said package is mounted onto a wiring board called mother board (2) providing connecting area corresponding to the connecting area of said small size package at the upper surface, characterized in that, contamination or dust existing in the gap between the upper surface of the mother board (2) and rear side of the chip carrier (1) can easily flow out and can be removed, thus improving reliability, by providing a through hole (7) at the chip carrier mounting area on said mother board (2).

REFERENCES:
patent: 3777220 (1973-12-01), Tatusko et al.
patent: 3794886 (1974-02-01), Goldman
Separating Semi-Conductor Devices from Supporting Substrates, Roush and Sullivan, IBM Tech. Discl. Bull., vol. 16, No. 1, Jun. 1973, p. 41.

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