Integrated circuit device having an opening exposing the integra

Details Integrated circuit device having an opening exposing the integra Integrated circuit device having an opening exposing the integra

1996-06-27

1999-01-19

Boudreau, Leo H.

Image analysis

Applications

Personnel identification

382312, 438127, G06K 928

Patent

active

058622489

ABSTRACT:
An integrated circuit device, such as a fingerprint sensing device, includes an integrated circuit die, a body of encapsulating material surrounding the integrated circuit die and having an opening therein exposing a portion of the integrated circuit die, and an electrically conductive member or frame being mounted to the body of encapsulating material adjacent the opening therein. The electrically conductive member may preferably be positioned so as to define at least a portion of a frame for the opening in the body of encapsulating material. The electrically conductive member may be adhesively secured to the integrated circuit die. Accordingly, the adhesive and electrically conductive member may serve as a seal to the interface between the body of encapsulating material and the die. The electrically conductive member may define a frame that surrounds a body of removable material during an intermediate stage in manufacturing. More particularly, the body of removable material and its frame may be positioned on the integrated circuit die while plastic is injection molded to encapsulate the asembly.

REFERENCES:
patent: 3781855 (1973-12-01), Killen
patent: 4312228 (1982-01-01), Wohltjen
patent: 4336998 (1982-06-01), Ruell
patent: 4353056 (1982-10-01), Tsikos
patent: 4394773 (1983-07-01), Ruell
patent: 4429413 (1984-01-01), Edwards
patent: 4512198 (1985-04-01), Sinha et al.
patent: 4526043 (1985-07-01), Boie et al.
patent: 4577345 (1986-03-01), Abramov
patent: 4581815 (1986-04-01), Cheung et al.
patent: 4582985 (1986-04-01), Lofberg
patent: 4684884 (1987-08-01), Soderlund
patent: 4761386 (1988-08-01), Buynoski
patent: 4895017 (1990-01-01), Pyke et al.
patent: 5210588 (1993-05-01), Lee
patent: 5264393 (1993-11-01), Tamura et al.
patent: 5325442 (1994-06-01), Knapp
patent: 5373181 (1994-12-01), Scheiter et al.
patent: 5400662 (1995-03-01), Tamori
patent: 5424249 (1995-06-01), Ishibashi
patent: 5429006 (1995-07-01), Tamori
patent: 5488719 (1996-01-01), Kaplan et al.
patent: 5497429 (1996-03-01), Shibuya
patent: 5503029 (1996-04-01), Tamori
patent: 5526701 (1996-06-01), Tamori
patent: 5559504 (1996-09-01), Itsumi et al.
patent: 5581226 (1996-12-01), Shah
patent: 5622873 (1997-04-01), Kim et al.
patent: 5677207 (1997-10-01), Ha
patent: 5682062 (1997-10-01), Gaul
R.P. James, IBM Technical Disclosure Bulletin, vol. 14, No. 11 ( Apr. 1972), "Finger-Print Sensor", p. 3361.

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