Integrated circuit device having an improved package structure

Details Integrated circuit device having an improved package structure Integrated circuit device having an improved package structure

1989-06-07

1991-08-20

Larkins, William D.

Optics: eye examining, vision testing and correcting

Spectacles and eyeglasses

Ophthalmic lenses or blanks

351 80, 361394, H01L 2302, H01L 2312

Patent

active

050418998

ABSTRACT:
An integrated circuit device includes a package having first and second surfaces and first and second internal connection lines. A semiconductor integrated circuit chip is mounted on the first surface of the package. A first group of external connection terminals is provided on the first surface of the package, and is electrically connected to the semiconductor integrated circuit chip through the first internal connection lines. A second group of external connection terminals is provided on the second surface of the package so as to form a matrix arrangement of terminals, and is electrically connected to the semiconductor integrated circuit chip through the second internal connection lines. The second group of external connection terminals includes specific terminals specifically passing signals to be supplied to or from the semiconductor integrated circuit chip. The signals passing through the specific terminals are signals used at the time of evaluating the semiconductor integrated circuit chip.

REFERENCES:
patent: 4141030 (1979-02-01), Eisele et al.
patent: 4338621 (1982-07-01), Braun
patent: 4387388 (1983-06-01), Zakhariya
patent: 4482781 (1984-11-01), Burns
patent: 4513355 (1985-04-01), Schroeder et al.
patent: 4608592 (1986-08-01), Miyamoto
patent: 4724472 (1988-02-01), Sugimoto et al.
patent: 4839717 (1989-06-01), Phy et al.
patent: 4918513 (1990-04-01), Kurose et al.

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