Integrated circuit device having an ic chip mounted on the wirin

Details Integrated circuit device having an ic chip mounted on the wirin Integrated circuit device having an ic chip mounted on the wirin

1991-09-06

1993-05-18

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Transmission line lead

257700, 257724, H01L 3902, H01L 2348, H01L 2946

Patent

active

052124037

ABSTRACT:
This invention discloses an integrated circuit device including an integrated circuit chip having logic circuits formed therein and a wiring substrate for mounting thereon the integrated circuit chip. The wiring substrate has signal wirings for connecting mutually input terminals and output terminals of the integrated circuit chip. The integrated circuit device includes signal wirings for effecting connections of the input terminals and output terminals of the same integrated circuit chip inside the wiring substrate. The logic circuits inside the same integrated circuit chip are mutually connected by signal wirings formed inside the integrated circuit chip when a wiring length is small, and are mutually connected by signal wirings formed inside the wiring substrate when the wiring length is great.

REFERENCES:
patent: 3634731 (1972-01-01), Skogmo
patent: 4551746 (1985-11-01), Gilbert et al.
patent: 5021869 (1991-06-01), Kaw
patent: 5055907 (1991-10-01), Jacobs
Patent Abstracts of Japan (JP-A-59-182540-Oct. 17, 1984), Abs. Pub. date-Feb. 22, 1985.
IBM Technical Disclosure Bulletin, vol. 28, No. 7, Dec. 1985, p. 2827.

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