Active solid-state devices (e.g. – transistors – solid-state diode – Gate arrays – With particular chip input/output means
Patent
1992-08-03
1994-06-07
Mintel, William
Active solid-state devices (e.g., transistors, solid-state diode
Gate arrays
With particular chip input/output means
257786, 257676, 257773, 437180, 437209, H01L 2702
Patent
active
053192249
ABSTRACT:
A method of manufacturing a plurality of integrated circuit devices includes the steps as follows. First, a predetermined plurality number of bonding pads (11, 21) in a predetermined geometry are formed on the surface of each of a plural number of substrate (10, 20). Next, circuits (12, 22) having different signal processing functions respectively are formed in regions of the substrates (10, 20) not occupied by the bonding pads (11, 21), and then, input/output terminals of the circuits (12, 22) are interconnected to respective ones of the bonding pads (11, 21). According to such a manufacturing method of integrated circuit devices, it is possible to employ common devices for wafer test and the same packages for incorporating, and thus reduce production cost and development cost, in case of small quantity production of various types.
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Kato Shuichi
Sakashita Kazuhiro
Takimoto Isao
Mintel William
Mitsubishi Denki & Kabushiki Kaisha
Potter Roy
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