Patent
1972-10-10
1977-01-11
Wojciechowicz, Edward J.
357 68, 357 69, 357 72, 357 73, H01L 2348, H01L 2328, H01L 2330
Patent
active
040030733
ABSTRACT:
Wire bonding is eliminated in the assembly of microelectronic devices, by a process involving the direct bonding of circuit electrodes to an unsupported metallic sheet-frame member having a plurality of inwardly extending leads. A single-step vibratory pressure welding technique is employed for the simultaneous bonding of all leads to a semiconductor integrated circuit chip. Lateral confinement of the leads during the bonding steps causes a buckling action to introduce a small but critical loop in each lead to ensure clearance between the lead fingers and the perimeter of the semiconductor chip, whereby electrical shorting is avoided. The loop also provides a structural flexibility in the leads, which tends to protect the bonding sites from excessive stresses. Subsequently, the first frame member including the bonded circuit is attached, preferably by resistance welding, to a second lead frame member of heavier gage and increased dimensions, suitable for connection with external circuitry. Excess portions of the first frame member are then removed, providing a completed assembly for packaging; e.g., plastic encapsulation or hermetic sealing, as in a ceramic-glass flat package.
REFERENCES:
patent: 3544857 (1970-12-01), Byrne et al.
Geyer Harry J.
Helda Robert W.
Motorola Inc.
Mueller Foorman L.
Olsen Henry T.
Wojciechowicz Edward J.
LandOfFree
Integrated circuit device employing metal frame means with prefo does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Integrated circuit device employing metal frame means with prefo, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit device employing metal frame means with prefo will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1747514