Integrated circuit device cooling structure

Details Integrated circuit device cooling structure Integrated circuit device cooling structure

1998-03-27

1999-11-23

Fahmy, Wael M.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257713, 257706, 257707, 257697, H01L 2334, H05K 720

Patent

active

059905506

ABSTRACT:
An integrated circuit device cooling structure includes a wiring substrate, an integrated circuit device, a heat sink, and heat radiation vias. The integrated circuit device is mounted on the first surface side of the wiring substrate. The heat sink is fixed to the second surface of the wiring substrate and thermally coupled to the wiring substrate. The heat radiation vias are formed in the wiring substrate to transmit heat generated by the integrated circuit device to the heat sink.

REFERENCES:
patent: 5396403 (1995-03-01), Patel
patent: 5523260 (1996-06-01), Missele
patent: 5585671 (1996-12-01), Nagesh et al.
patent: 5744863 (1998-04-01), Culnane et al.
patent: 5751062 (1998-05-01), Daikaku et al.
Japanese Office Action datedOct. 20, 1998, with partial translation.
"Thermal Compound for Semiconductor Packages", by E. R. Mondou and S. P.Young, IBM Technical Disclosure Bulletin, vol. 25 No. 7B, Dec. 1982, pp. 4035-4036.
"Parts and Packaging Technologies for GS8600 and GS8400" by Y. Morita et al., FUJITSU. 47.2., Mar. 1996, pp. 132-138.

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