Integrated circuit device and method to prevent cracking during

Details Integrated circuit device and method to prevent cracking during Integrated circuit device and method to prevent cracking during

1994-02-16

1995-07-18

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437211, 437214, 437215, 437217, 437220, H01L 2160

Patent

active

054341060

ABSTRACT:
A semiconductor package device is disclosed. In one embodiment, attached by its active face to a lead-on-chip leadframe having leadfingers is an integrated circuit. The integrated circuit has a polyimide coating on its backside. An encapsulating material surrounds the integrated circuit and the lead-on-chip leadframe so that the leadfingers are exposed. The polyimide coating on the backside of the integrated circuit helps to reduce package cracking arising from mounting the device to a printed circuit board by relflow solder.

REFERENCES:
patent: 4862245 (1989-08-01), Pashby et al.
patent: 4903113 (1990-02-01), Frankeny et al.
patent: 4916519 (1990-04-01), Ward
patent: 4965654 (1990-10-01), Karner et al.
patent: 5070039 (1991-12-01), Johnson et al.

Affiliated with

Also associated with

Rating

Integrated circuit device and method to prevent cracking during does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated circuit device and method to prevent cracking during , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit device and method to prevent cracking during will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2418947