Integrated circuit device and method to prevent cracking during

Details Integrated circuit device and method to prevent cracking during Integrated circuit device and method to prevent cracking during

1994-08-25

1995-05-23

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437210, 437211, 437214, 437217, H01L 2160

Patent

active

054181895

ABSTRACT:
A lead over chip packaged device that is less prone to package cracking during surface mounting is disclosed. The lead over chip lead frame overlies the active face of a semiconductor circuit, The backside of the semiconductor circuit is covered with an ainopropyltriethoxysilane coating. The aminopropyltriethoxysilane coating promotes adhesion between the backside of the semiconductor circuit and the mold compound used to encapsulate the device. This reduces package cracking resulting from delamination between the inactive face of the chip and the mold compound during reflow solder.

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patent: 4732858 (1988-03-01), Brewer et al.
patent: 4908086 (1990-03-01), Goodrich et al.
patent: 5026667 (1991-06-01), Roberts, Jr.
patent: 5164815 (1992-11-01), Lim

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