Integrated circuit device and method for manufacturing the same

Details Integrated circuit device and method for manufacturing the same Integrated circuit device and method for manufacturing the same

1993-01-25

1994-04-26

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437211, 437214, 437217, 437220, 148DIG158, H01L 2160

Patent

active

053066693

ABSTRACT:
An integrated circuit device having an electronic circuit component connected by wire-bonding is characterized in that a masking member having a lower sputtering rate than that of the material forming the electrodes to be used for the wire-bonding is arranged around the electronic circuit component. A method for manufacturing an integrated circuit device having an electronic circuit component connected by wire-bonding is characterized in that a masking member having a lower sputtering rate than that of the material forming the electrodes to be used for the wire-bonding is arranged around the electronic circuit component.

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