Integrated circuit device and method for manufacturing the same

Details Integrated circuit device and method for manufacturing the same Integrated circuit device and method for manufacturing the same

1991-11-18

1993-03-23

Wojciechowicz, Edward J.

357 67, 357 68, H01L 2948

Patent

active

051969181

ABSTRACT:
An integrated circuit device having an electronic circuit component connected by wire-bonding is characterized in that a masking member having a lower sputtering rate than that of the material forming the electrodes to be used for the wire-bonding is arranged around the electronic circuit component. A method for manufacturing an integrated circuit device having an electronic circuit component connected by wire-bonding is characterized in that a masking member having a lower sputtering rate than that of the material forming the electrodes to be used for the wire-bonding is arranged around the electronic circuit component.

REFERENCES:
patent: 3747202 (1973-07-01), Jordan
patent: 3908184 (1975-09-01), Anazawa et al.
patent: 4300153 (1981-11-01), Hayakawa et al.
patent: 4444349 (1984-04-01), Bilane et al.
patent: 4735662 (1988-04-01), Szabo et al.
patent: 5016089 (1991-05-01), Fujii et al.
patent: 5049976 (1991-09-01), Demmin et al.

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