Integrated circuit device and its manufacturing method

Details Integrated circuit device and its manufacturing method Integrated circuit device and its manufacturing method

1994-11-18

1996-06-18

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174268, 257692, 257713, 361704, 361773, H05K 720

Patent

active

055284582

ABSTRACT:
An integrated circuit device is disclosed that comprises a bare integrated circuit chip, having an integrated circuit section and pad sections, said chip being mounted on an insulated surface of a substrate, and an electro-conductive circuit pattern wiring formed on said insulating surface along the periphery of said chip. Tape automated bonding wiring is used to electrically connect the pad sections of the chip to an end of the circuit pattern wiring. Terminals are electrically connected to the other end of the circuit pattern wiring for use in electrically connecting the integrated circuit device to electronic equipment.

REFERENCES:
patent: 4812949 (1989-03-01), Fontan
patent: 5173844 (1992-12-01), Adachi
patent: 5267867 (1993-12-01), Agahdel
patent: 5331235 (1994-07-01), Chun
patent: 5386342 (1995-01-01), Rostoker
patent: 5397917 (1995-03-01), Ommen
patent: 5398160 (1995-03-01), Umeda

Affiliated with

Also associated with

Rating

Integrated circuit device and its manufacturing method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated circuit device and its manufacturing method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit device and its manufacturing method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-227683