Integrated circuit device and fabricating thereof

Details Integrated circuit device and fabricating thereof Integrated circuit device and fabricating thereof

1997-10-22

1998-07-28

Meier, Stephen

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Smart card package

257691, H01L 2302, H01L 2352

Patent

active

057866279

ABSTRACT:
An integrated circuit device includes a substrate, circuit elements on the substrate, and an electrically conductive thermoplastic resin substance electrically connecting the circuit elements on the substrate. Therefore, since variations in the configuration of the thermoplastic resin are quite small relative to those of interconnecting wires, variation in parasitic inductance due to variation in the configuration of the connections is reduced and the uniformity and the reproducibility of the high frequency characteristics of the integrated circuit device are enhanced. A method for fabricating an integrated circuit device includes forming circuit elements on a substrate and forming an electrically conducting thermoplastic resin substance electrically connecting the circuit elements.

REFERENCES:
patent: 4296424 (1981-10-01), Shibasaki et al.
patent: 4401966 (1983-08-01), Ohmura et al.
patent: 5084107 (1992-01-01), Deguchi et al.
patent: 5146296 (1992-09-01), Huth
patent: 5598032 (1997-01-01), Fidalgo

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