Integrated circuit device and a method of making the...

Details Integrated circuit device and a method of making the... Integrated circuit device and a method of making the...

2011-05-17

2011-05-17

Nguyen, Cuong Q (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S723000, C257S686000, C257S784000, C257S700000, C257S778000, C257SE23028

Reexamination Certificate

active

07944050

ABSTRACT:
An integrated circuit device comprises a first semiconductor chip on a first substrate and a second semiconductor chip on a second substrate. A side surface of the first semiconductor chip is facing a side surface of the second semiconductor chip. At least one electric cable is provided to be connecting the first substrate to the second substrate.

REFERENCES:
patent: 5646446 (1997-07-01), Nicewarner, Jr. et al.
patent: 6869825 (2005-03-01), Chiu
patent: 2005/0041402 (2005-02-01), Cady et al.
patent: 2007/0092996 (2007-04-01), Lo et al.
patent: 2007/0252284 (2007-11-01), Su et al.
patent: 2008/0157318 (2008-07-01), Chow et al.

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