Integrated circuit device

Details Integrated circuit device Integrated circuit device

1977-12-30

1979-02-20

James, Andrew L.

Stock material or miscellaneous articles

Composite

Of bituminous or tarry residue

357 71, 357 72, 428596, 174 52FP, H01L 2348, H01L 2944, H01L 2952

Patent

active

041410297

ABSTRACT:
An improved integrated circuit device includes a lead frame having a pad and having a plurality of lead members extending away from a location adjacent to the pad. The lead frame is blanked from a metal laminate which is formed by pressure bonding a layer of copper to each of two opposite sides of a layer of high chromium-low nickel stainless steel and which is annealed and then provided with a selected degree of work-hardening prior to blanking. The blanked lead frame surfaces are plated with an inner nickel plating and with an outer silverplating. An integrated circuit unit is mounted on the lead frame pad and terminals of the unit are connected to selected lead members. The pad, unit and portions of the lead members are encapsulated in a non-conductive organic material to permit ends of the lead members to extend from the encapsulation. The device displays an improved combination of technical properties in a low cost structure.

REFERENCES:
patent: 3422320 (1969-01-01), Woodling
patent: 3436810 (1969-04-01), Kauffman
patent: 3559285 (1971-02-01), Kauffman
patent: 3566207 (1971-02-01), Adams
patent: 3773628 (1973-11-01), Misawa et al.
patent: 3839660 (1974-10-01), Stryker
patent: 4065625 (1977-12-01), Iwai et al.

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