Integrated circuit device

Details Integrated circuit device Integrated circuit device

1988-10-03

1990-04-24

James, Andrew J.

357 40, H01L 2702

Patent

active

049204025

ABSTRACT:
The present invention is directed to an integrated circuit having multilayer structure. In the present invention, dummy elements having no relation to the operation of an integrated circuit are formed on the upper surface of a substrate provided with the integrated circuit by the same material as that for the substrate, to thereby prevent the integrated circuit provided on the substrate from direct and correct observation. As the result, formation arrangement etc. of the integrated circuit cannot be easily analyzed, whereby interests of those contributing to technology development can be sufficiently protected.

REFERENCES:
patent: 4766516 (1988-08-01), Ozdemir et al.
"Three-Dimentional IC Trends", Yoichi Akasaka, Proceedings of the IEEE, vol. 74, No. 12, Dec. 1986, pp. 1703, 1707 and 1708.

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