Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2006-09-28
2009-02-10
Ho, Tu-Tu V (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S713000, C257SE23095, C257SE23099
Reexamination Certificate
active
07489034
ABSTRACT:
A system and method for cooling an integrated circuit is provided. One aspect of this disclosure relates to a cooling system that utilizes sound waves to cool a semiconductor structure. The system includes a container to hold at least one semiconductor chip having surfaces to be in contact with a fluid. The system also includes a transducer and a heat exchanger disposed within the container and operably positioned with respect to each other to perform a thermoacoustic cooling process. In this system, the transducer is adapted to generate sound waves within the fluid such that compression and decompression of the fluid provides a temperature gradient across the semiconductor chip to transfer heat from the semiconductor chip to the heat exchanger, and the heat exchanger is adapted to remove heat from the fluid in the container. Other aspects and embodiments are provided herein.
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U.S. Appl. No.
Ho Tu-Tu V
Micro)n Technology, Inc.
Schwegman Lundberg & Woessner, P.A.
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