Integrated circuit cooling device having internal baffle

Details Integrated circuit cooling device having internal baffle Integrated circuit cooling device having internal baffle

1994-07-14

1995-02-14

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165 803, 165 804, 16510433, 174 152, 257716, 361690, 361699, 29890032, 2989003, H05K 720

Patent

active

053900774

ABSTRACT:
An apparatus for cooling an integrated circuit device includes a container defining a chamber that is partially filled with a coolant which forms a coolant pool in the chamber, wherein heat generated by the integrated circuit device causes boiling of the coolant at a heating area of the coolant pool so that vaporized coolant rises upwardly from the coolant pool and condenses on a ceiling of the chamber forming coolant droplets thereon. The apparatus further includes a baffle positioned within the chamber and at least partially out of the coolant pool, the baffle further being positioned within a path traveled by the coolant droplets falling from the ceiling due to gravity, wherein the baffle is configured to guide the coolant droplets away from the heating area of the coolant pool as the coolant droplets fall from the ceiling towards the coolant pool due to gravity.

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