Integrated circuit cooling apparatus and method

Details Integrated circuit cooling apparatus and method Integrated circuit cooling apparatus and method

2004-09-15

2008-03-11

Thompson, Gregory D (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C062S003200, C165S104330, C165S080200, C165S185000, C361S704000, C361S710000, C361S715000

Reexamination Certificate

active

07342787

ABSTRACT:
In various embodiments, heat from a computer component may be absorbed into a medium, moved to a remote heat dispersal unit and dissipated into the surrounding air. In some embodiments, the heat dispersal unit may include a heat sink. In some embodiments, the medium may include a liquid metal. In various embodiments, a vapor compression system may include an evaporator, a compressor, a condenser, and an expansion valve. In some embodiments a separate heat pipe may be placed between the computer component and the evaporator. In various embodiments, a thermo conductive plate may be used to thermally couple the heat pipe to various components including the computer component, evaporator, condenser, and/or heat sink. In some embodiments, a thermo electric module (TEM) may be coupled to various parts of the system.

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